Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The final circuit design I achieved by the use of photo imaging. Copper is electroplated to the printed circuit in order to get the final thickness. The final circuits should be well protected in the next etching and it is therefore important to apply a thin layer of lead or tin solder. The copper will be exposed by getting rid of the tin or lead solder, because it will not be a component of the final circuit. The unwanted copper is etched away using either sulfuric acid solution or an ammonia based solution.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The final circuit design I achieved by the use of photo imaging. Copper is electroplated to the printed circuit in order to get the final thickness. The final circuits should be well protected in the next etching and it is therefore important to apply a thin layer of lead or tin solder. The copper will be exposed by getting rid of the tin or lead solder, because it will not be a component of the final circuit. The unwanted copper is etched away using either sulfuric acid solution or an ammonia based solution.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.